The World fastest Pick & Place Inspection Machine
● High Productivity
● Enhanced Adv’ PKG Inspection
● Safety & Convenience
● Easy to Maintenances
Change of semiconductor market
PKG Inspection Trend – Advanced PKG Inspection
High Productivity
• Up to 22K UPH (Included PVI)
• Full Coverage of PKG 6-side Inspection Up to 10K UPH (Included PVI)
Enhanced Adv’ PKG Inspection
• Enhanced Both side 3D Inspection → Die Height, Under Fill, MLCC, L/D Hole, Mold Height, Warpage..
• MH/TH & Real Total Height Inspection
• LFF(Large Form Factor) Package Stitched inspection
• Small ball and Fine Pitch(0.1ball 0.2pitch)
Safety & Convenience
• Fully-Automated Job Conversion
• LTSM (Self Diagnosis) =>Illumination Uniformity, Vision calibration, Picker status..
Easy to Maintenances
• Single Type Picker Maintenance-friendly Design
• Anti-Vibration Design
* Please request detail information about the high-light technology
| Basic System Specification | |
| Packages | LGA/ DSMSiP/ QFP/ BGA/ BOC/ QFN / uSD CARD etc. |
| Max. Package Size | 65 mm X 58 mm > No Stitching 120mm X 120mm >Stitching |
| Tray Type | JEDEC/ EIAJ Standard |
| Input Tray | Max. 45 Trays |
| User Interface | 24” LCD/ Keyboard/ Trackball/ Barcode Reader |
| Dimension | 2400 X 1770 X 1810 mm3 3430 X 1900 X 2230 mm3 (for Factory Automation) |
| Certification | CE Certified |
| Power | AC 220V/ 1 Phase/ 50 A |
| Air | 5 ~ 6 kgf/cm2 |
| Weight | 3.5 ton (Main Body) |
| UPH | -. 25K UPH ( Top/Bottom ) @Tray Matrix 10 x 24 -. 10K UPH ( Top/Bottom + 4-Side ) @Tray Matrix 10 x 24 |
| Inspection Type | -. Pick & Place Type Inspection |
| Vision System | -. 2D / 3D Vision : Ball side Vision -. 2D Vision : Mark Side Vision -. 2D Vision : 4-Side Vision -. 3D Vision : Mark side Vision( Top-Option ) |
| Handler System | -. 10 PARA Single Head Insp. Picker * 2 (Auto Conversion) -. 10 PARA Rotate Single Head Side Insp. Picker * 1 (Auto Conversion) -. 6 PARA Single Head Sorting Picker *1 (Auto Conversion) -. Tray Transfer Module -. 5 Rails System (Loading / Empty / Reject 1, 2 / Good ) |
| Special Function | -. Double Device & Empty Pocket Check Sensor
( Vision Built-In or Sorter Built-In ) -. Auto Diagnosis Function -. Continuous Lot Inspection -. 2D matrix Code Reading |
* The specification above might be changeable to improve the tool.
> CXP Express Interface Camera is adopted for High Speed Scanning
> Providing User Define Item Tool for high performing Surface Inspection
 | Top 2D Inspection Vision Module | |
F.O.V. | 70 x 60 mm2 | |
Pixel No. | 48 Mega Pixels / 7,920(W) x 6,004(H) | |
| Pixel Resolution | 10 um/pixel | |
| Camera Lens | Telecentric Lens( TCL 0.6XXx ) | |
| Illumination | 12-Ch LED illumination (Coaxial + Oblique + Indirect) for Top Vision | |
| Inspection Items | Mark Quality, Top Surface etc. |
 | Bottom Inspection Vision Module | ||
| 2D | F.O.V. | 70 x 60 mm2 | |
| Pixel No. | 48 Mega Pixels / 7,920(W) x 6,004(H) | ||
| Pixel Resolution | 10 um/pixe | ||
| Camera Lens | Telecentric Lens( TCL 0.6XXx ) | ||
| Illumination | 12-Ch LED illumination (Coaxial + Oblique + Indirect) for Top Vision | ||
| 3D | F.O.V. | 60mm | |
| Pixel No. | 12Mega Pixel / 4096(W) x 3072(H) | ||
| Camera Lens | Telecentric Lens( TCL 0.3xxx ) | ||
| Resolution | X Lateral Resolution : 14.67 um/Pixel, Z Optical Res : 12.79 um/Pixel ( 2um / Sub Pixel) | ||
| Scan Speed | 380mm/sec.(Max) | ||
> Direct See the PKG 4-side with multi-illumination condition
> Easy to implement various defect mode & No Conversion Kit required
 | 4-SIde Inspection Vision Module (Optional) | |
F.O.V. | 50 x 10 mm2 | |
Pixel No. | 25 Mega Pixels / 5,120(H) x 5,120(W) | |
| Pixel Resolution | 9.78 um/pixel | |
| Lens | Telecentric Lens.( TCL 0.4XXx -150(W) ) | |
| Illumination | 10-Ch LED illumination (Coaxial + Oblique) for Side Vision | |
> Complex Lighting System Adopted : Specular and Diffused reflection
 | Top 3D Inspection Vision Module (Optional) | |
F.O.V. | 45 mm | |
Pixel No. | 5 Mega Pixels / 2560(H) x 2048(V) | |
| Frame rates | 210 fps(6.25 Gbps with 2Ch), About 4000fps(partial) | |
| Resolution | X Lateral Resolution :: 18.5 um/Pixel Diffused reflection Z Resolution :: 37.04 um/pix (3um / Sub Pixel) Specular reflection Z Resolution :: 18.52 um/pix (2um / Sub Pixel) | |
| Inspection Item | Die Height, Under fill Height, Dent, Mark Depth, L/D Hole Depth, Mold Height, Warpage | |
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