● High volume, small footprint and low cost of ownership
● Production-ready strip handling system
● Highly uniform plasma treatment with fast throughput rates
● Service components accessible via front pull-out shelves
● Easy to use touch screen graphical user interface (GUI)
Built upon Nordson MARCH’s patented plasma technology, the FlexTRAK™-CDS platform is just one of many plasma systems incorporated with a high capacity chamber, which provides high uniformity and process repeatability. It ensures all areas of the substrate are treated uniformly.
Similar to its smaller brethren, the FlexTRAK-CDS platform is designed for high throughput processing of lead frame strips, laminated substrates, and other striptype electronic components, up to 10 strips per plasma cycle.
The system accommodates a wide range of strip sizes, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.
Plasma for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill such as:
Contamination Removal & Surface Cleaning
● Fluorine & other halogens
● Metals & metal oxides
● Organic compounds
Etching and Surface Roughening
● Improve die adhesion & wire bonding
● Improve mold adhesion & reduce delamination
Surface Activation
● Improve die adhesive flow, eliminate voids and enhance adhesion
● Improve mold material flow, eliminate voids and reduce wire sweep
● Improve underfill flow, eliminate voids, enhance adhesion, and increase wicking speed
| Enclosure Dimensions | W x D x H – Footprint | 1190W x 1320D x 1640H; 2114H mm with Light Tower (47W x 52D x 65H; 83H in. with Light Tower) |
| Net Weight | 550 kg (1213 lbs) | |
| Equipment Clearances | Right, Left, Back – 254 mm (10 in.), Front – 940 mm (37 in.) | |
| Chamber | Maximum Volume | 9.6 liters (585 in³) |
| Electrodes | Variable Electrode Configurations | Power-Ground, Ground-Power, Power-Power |
| Working Area | 305W x 550D mm (12W x 21D in.) | |
| RF Power | Standard Wattage | 600 W |
| Optional Wattage | 1000 W | |
| Frequency | 13.56 MHz | |
| Gas Control | Available Flow Volumes | 10, 25, 50, 100, 250 or 500 sccm |
| Maximum Number of MFCs | 4 | |
| Control & Interface | Software Control | PLC Control with PC-Based Touch Screen Interface |
| Remote Interface | SMEMA, SECS/GEM | |
| Vacuum Pump | Standard Dry Pump | 16 cfm |
| Optional Wet Pump | 19.5 cfm | |
| Optional Purged Dry Pump | 16 cfm | |
| N2 Purged Pump Flow | 2 slm | |
| Facilities | Power Supply | 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire |
| Process Gas Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Process Gas Purity | Lab or Electronic Grade | |
| Process Gas Pressure | 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated | |
| Purge Gas Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Purge Gas Purity | Lab or Electronic Grade N2/CDA | |
| Purge Gas Pressure | 2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated | |
| Pneumatic Valves Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Pneumatic Gas Purity | CDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size<5 µm | |
| Pneumatic Gas Pressure | 3.45 bar (50 psig) min. to 6.89 bar (100 psig) max., regulated | |
| Exhaust | 25.4 mm (1 in.) OD Pipe Flange | |
| Compliance | SEMI | S2/S8 (EH&S/Ergonomics) |
| International | CE Marked | |
| Ancillary Equipment | Gas Generators | Nitrogen, Hydrogen (Requires Additional Non-Optional Hardware) |
| Facilities | Chiller, Scrubber |
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