Industry-Leading Throughput and Reliability for Semiconductor Packaging Applications
Built on Nordson MARCH patented plasma technology, theFlexTRAK®–SHS offers full automation with a high-capacityF3-S chamber to increase uniformity and productivity.
The chamber architecture remains the same as the smallerFlexTRAK platform, providing a seamless transition betweenchambers to scale for increasing production demand.
A FlexTRAK–SHS variant with a standard F3 chamber isavailable if the capacity of the F3-S chamber is not required.
Industry-Leading Throughput
● Large capacity F3-S process chamber.
● Simultaneous strip buffering and processing.
● Advanced automation and magazine-splitting capabilities
New Product Development
● Advanced material handling.
● Ability to accommodate increasingly larger strip sizes.
● Sophisticated jam detection.
Application Flexibility
● Plasma chamber effectiveness.
● Configurable process chamber.
● Versatile treatment modes.
● Pre-wire bond plasma treatment onsemiconductor package substrates and leadframes.
● Pre-underfill plasma treatment on flip chippackages.
● Pre-mold plasma treatment on semiconductorpackage substrates and lead frames.
● Plasma treatment of semiconductor packagesubstrates and lead frames for improvedadhesion.
● Removal/reduction of oxidation on leadframes.
| EnclosureDimensions | W x D x H – Footprint | 2314 W x 1935 D x 1787 H mm (2293 H mm with light tower) 91.1 W x 76.2 D x 70.5 H in (90.3 H in with light tower) |
| Net Weight | 1305 kg (2,871 lbs) | |
| Equipment Clearances | All sides – 700 mm (27.6 in) | |
| Chamber | Volume | F3-S chamber: 9.6 liters (585 in³) F3 chamber: 5.5 liters (338 in³) |
| Electrodes | Powered Electrode Dimensions | F3-S chamber: 305 W x 610 D mm / 12 W x 24 D in F3 chamber: 305 W x 305 D mm / 12 W x 12 D in |
| RF Power | Standard Wattage | F3-S chamber: 1000 W |
| Frequency | 13.56 MHz | |
| Gas Control | Maximum Number of MFCs | 3 |
| Control System | Interface | EPC with PC-based touchscreen interface |
| Remote Interface | Remote Interface | SECS/GEM, Remote HMI |
| Vacuum Pump | Standard Purged Dry Pump | 16 CFM, Variable Frequency Drive |
| N2 Purged Pump Flow | 2 SLM | |
| Facilities | Power Supply | 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire |
| Process Gas Fitting Size & Type | .25-in OD Swagelok Compression | |
| Process Gas Purity | Industrial grade or better | |
| Process Gas Pressure | Regulated from .69 bar (10 psig) min to 1.4 bar (20 psig) max | |
| Purge Gas Fitting Size & Type | .25-in OD Swagelok Compression | |
| Purge Gas Purity | Industrial grade Nitrogen or CDA | |
| Purge Gas Pressure | Regulated from 5.5 bar (80 psig) min to 6.9 bar (100 psig) max | |
| Pneumatic Valves Fitting Size & Type | 10 mm push-in fitting | |
| Pneumatic Gas Purity | CDA, Oil Free, Dewpoint <=7 °C /45 °F, Particulate Size <5 micron | |
| Pneumatic Gas Pressure | 4.5 – 6 bar (65 – 87 psig) | |
| Handler Exhaust Fitting | 4.5 – 6 bar (65 – 87 psig) | |
| Compliance | Certifications | CE Marked, SEMI S2/S8 (EH&S/Ergonomics) |
| Ancillary Equipment | Nitrogen Generator (option) | Necessary for Purge Gas Requirements |
| Chiller (option) | Required When Configured with Cooled Electrode | |
| Hydrogen Kit (option) | Allows System to Use Hydrogen Gas for Processing | |
| Scrubber (option) | Intended for Fluorinated Operations on the System | |
| Shipping | Gross Weight | 1505 kg |
| Number of Packages | 1 | |
| Packing Conforms to ISPM 15 | Yes |
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