Camtek-EAGLE-I PLUS-双赢电子科技国际有限公司

●　检测灵敏度Bright Field-0.42μm；Dard Field-0.3μm

●　多重放大，优化灵敏度

●　可用分区域的检测算法，以优化灵敏度

●　可导入CAD设计图，基于图纸检测

●　能够在一个检测周期内使用不同的聚焦、放大倍率、光源、灵敏度和检测引擎运行连续扫描

●　设备互匹配-从设备到设备的简单配方传输

产品详情

领先的2D检测能力

• 算法提供的亚微米缺陷检测

• 可导入CAD设计图，基于图纸检测

• 多层RDL应用的清晰视觉光源

• 切割后晶片的内部隐裂检测（ICI）

• 背光照明技术

尖端平台

• 定制光学器件

• 高强度LED照明

• 显著提高了产量

2D检测

Inspection Capabilities 检测能⼒	Various surface defects inspection of 1 pixel size for Bright Field and 0.5 pixel size for Dark Field 各种表⾯缺陷，明场可达1个像素⼤⼩缺陷，暗场可达0.5个像素⼤⼩缺陷
Resolution 解析度	Multiple magnifications for optimized sensitivity 多重倍率并优化敏感度
Zone Editing 区域编辑	CAD based detection 基于CAD图档的检测
CAD	Enables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection enginea
Multi Recipe 多重程式并⽤	Enables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection engines 允许在⼀个周期内运⾏连续扫描，使⽤不同的对焦位置，倍率，照明，灵敏度和检测引擎
Defect Classification / Filtering 缺陷⾃动分类/过滤	Feature based classification 基于特征的分类
Tool Matching 机台⾃动匹配	Simple recipe transfer from system to system 简单的程式传送⽅式，从⼀个机台转移到另⼀个机台 System to System results matching 机台互相之间的检测结果匹配

3D检测

Bumptypes 凸块类型	Copperpillar,solder,goldbumps,microbumps 铜柱，电镀，⾦凸块，微凸块等
Capabilities 能⼒	Measurementofbumpheight,co-planarity,PR/PI thicknessandviaopeningdepthandsurface-tosurfacemetrology 凸块⾼度量测、共⾯性、PR/PI厚度、通孔深度，以及⼀个⾯对另外⼀个⾯的量测
CTS‒CamtektriangulationSensor:Highspeed3Dscan CTS-Camtek三⻆测量传感器：⾼速3D扫描
HeightAccuracy① ⾼度精度①	0.1μm
HeightRepeatability① ⾼度重复精度①	1%ofbumpheightand>0.2μmat3σ
MeasurementRange 量测范围	2‒250μm
CCS-CamtekConfocalSensor:3Dhighresolutionprofileareamapping CCS‒Camtek共焦传感器：三维⾼分辨率剖⾯区域制图
HeightRepeatability① ⾼度重复精度①	0.1μmat3σ
LayerthicknessRange 膜厚量测范围	5-200μm
Heightmetrologyrange ⾼度量测范围	1μm-300μm
CLIP‒CamtekLightinterferometerprofiler: CLIP‒Camtek光⼲涉仪分析器
Resolution 解析度	0.05μm
HeightRepeatability① ⾼度重复精度①	0.2μmat3σ
MeasurementRange 量测范围	0.2-100μm

2D量测

Object types 对象类型	Bump, RDL, Pad, UBM, Via
Capabilities 能⼒	Measurement of diameter, width, length, placement deviations, overlay, die shift 可测量直径，宽度，⻓度，放置偏差，叠加，晶粒移位等
Accuracy 精度	0.1μm
Repeatability 重复精度	0.2μm at 3σ

程式设定

Setup Online and Offline 可在线和离线进⾏程式设定	User-defined detection parameters per defect type and zone. ⽤⼾可根据区域和缺陷类型定义检测参数 Interactive automated routines for easy zone definition 交互式⾃动化例⾏程序易于各区域的定义
Job Portability & Tool Matching 程式易于移植和机台⾃动匹配	Allows transfer of jobs between compatible models 允许同型号机台间程式的互相传送 running on same SW version for system to system results matching 基于同软件版本，机台与机台扫描结果的匹配

复判和缺陷分类

Review Options 复判选项	Color 彩⾊影像 Black & White ⿊⽩影像 IR 红外影像
Smart Grab 智能抓取缺陷照⽚	Customized preset for defect type, count and location, minimizing grabbing and verification time, optimizing image quality to defect type 定制预设缺陷类型、数量和位置，最⼩化抓取和验证时间，根据缺陷类型优化图像质量
Offline Station 离线⼯作站	PC-based station for viewing and reclassification of defect images captured during scanning (monochrome) or post-scanning (color and/or monochrome) 基于PC⼯作站，⽤于查看和重新分类扫描期间(⿊⽩影像)或扫描后(彩⾊和/或⿊⽩影像)抓取的缺陷图像

输出 ‒ Camtek统计过程控制软件包

Histograms 直⽅图	Distribution charts of all defect and metrology data 所有缺陷及量测数据分布图
Reports 报告	SPC analysis at lot, wafer and die level, KLARF 对批次，晶圆和晶粒级进⾏SPC分析
Wafer Maps 晶圆图档	Generate, import, edit and export wafer maps in over 50 standard and custom formats ⽣成，导⼊，编辑和导出超过50种标准和⾃定义格式的晶圆图

系统配置

Material Handling Dual Arm Auto Loader 双⼿臂⾃动取放⽚机构	Dual purpose bare & framed on the same load port 同⼀装载平台上同时⽀持晶圆盒和铁圈盒 Supports Bare, Taiko, Framed, Stretched and Reconstructed wafers ⽀持Bare, Taiko, Framed, Stretched and Reconstructed 晶圆 4”-12” wafer size 晶圆尺⼨4”-12”
Particle Removal System 微尘去除系统	Removes loose particles, eliminating nuisance calls 去除表⾯微尘，减少误报
OCR ⾃动⽂字识别系统	Automatic top or bottom wafer ID reading ⾃动正⾯和反⾯的晶圆刻号读取
Barcode Reader 条码读取系统	Reads data matrix or barcode formats 可识别⼆维码和条形码
Factory Automation ⼯程⾃动化	SECS/GEM or customized host communication; OHT/AGV ready SECS/GEM或定制化的主机通信; ⽀持天⻋ /⾃主移动⼩⻋
Cleanliness 洁净度	Semi class 2 according to ISO-150-14644-1 基于ISO-150-14644-1的Semi class 2

①‒AccuracyandrepeatabilityonVLSIsteptarget

①‒基于VLSI标准⽚的精度和重复精度量测